This page offers an overview of the IPC standards for the printed circuit board industry.
As default the IPC standards 6011, 6012, 6013 und 6016, class II are used. The conformity of the pcb's is inspected according to IPC-A-600.
|
General |
name |
| Terms and definitions for interconnecting and packaging electronic circuits | IPC-T-50 |
| Dimensions and tolerances | IPC-D-300 |
|
Design |
name |
| Surface mount design and lands pattern standard | IPC-SM-782 |
| Design guidelines for reliable SMT printed board assemblies | IPC-D-279 |
| Generic standard for printed board design | IPC-2221 |
| Sectional design standard for rigid organic boards | IPC-2222 |
| Sectional design standard for flexible printed boards | IPC-2223 |
|
Material |
name |
| Specification for base materials for rigid and multilayer printed boards | IPC-4101 |
| Specification for base materials for HF applications | IPC-4103 |
| Flexible base dielectrics for use in flexible printed circuitry | IPC-4202 |
| Adhesive coated dielectric films for use as cover sheets for flexible printed circuitry and flexible adhesive bonding films | IPC-4203 |
| Flexible metal-clad dielectrics for use in fabrication of flexible printed circuitry | IPC-4204 |
| Metal foil for printed wiring applications (i.e. Cu, Ni) | IPC-4562 |
| Composite metallic material specification for printed boards (CIC, CMC) | IPC-CF-152 |
| Qualification and performance of permanent solder mask | IPC-SM-840 |
|
Production |
name |
| Generic performance specification for printed boards | IPC-6011 |
| Qualification and performance specification for rigid printed boards | IPC-6012 |
| Qualification and performance specification for flexible printed boards | IPC-6013 |
| Micro vias | IPC-6015 |
| Qualification and performance specification for high density interconnect layers or boards. (HDI) | IPC-6016 |
| High frequency materials | IPC-6018 |
|
Conformity inspection |
name |
| Acceptability of printed boards | IPC-A-600 |