All of our printed circuit boards are subject to a monitored assembly.
Product range
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Finish
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one-sided board double-sided board multilayer microvia multilayer HF boards microstrip metal core multilayer hybrid multilayer impedance controlled circuits IMS circuits
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rigid flexible rigid-flex
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Surfaces
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Prints
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electroless Ni/Au electroless Sn galvanic Ni/Au hot air leveling (lead free) hot air leveling (leaded) Pb/Sn (oil) reflow electroless Ni Pd Au electroless Ag mixed surfaces
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via print screen printing special prints
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Specific features
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Miscellaneous
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copper-clad Invar (CIC) cores heatsinks on outer layers made from Cu, Al or CIC heatsinks on inner layers made from Cu or CIC cores made from Al mixed laminates from teflon and ceramic blind and buried vias laser drilled microvias thermal management press-fit technology backdrilling microvia-Filling hole-plugging
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CofC / certificate of compliance with the order initial sample test report impedance check with test report
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