All of our printed circuit boards are subject to a monitored assembly.
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Product range
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Finish
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one-sided board
double-sided board
multilayer
microvia multilayer
HF boards
microstrip
metal core multilayer
hybrid multilayer
impedance controlled circuits
IMS circuits
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rigid
flexible
rigid-flex
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Surfaces
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Prints
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electroless Ni/Au
electroless Sn
galvanic Ni/Au
hot air leveling (lead free)
hot air leveling (leaded)
Pb/Sn (oil) reflow
electroless Ni Pd Au
electroless Ag
mixed surfaces
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via print
screen printing
special prints
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Specific features
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Miscellaneous
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copper-clad Invar (CIC) cores
heatsinks on outer layers made from Cu, Al or CIC
heatsinks on inner layers made from Cu or CIC
cores made from Al
mixed laminates from teflon and ceramic
blind and buried vias
laser drilled microvias
thermal management
press-fit technology
backdrilling
microvia-Filling
hole-plugging
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CofC / certificate of compliance with the order
initial sample test report
impedance check with test report
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