Micro vias

Design overview for high density interconnects (HDI) and laser drilled micro vias according to IPC / JPCA-2315

micro vias

Type I  (1C1) (1C0)

 micro vias

Multilayer with micro vias
on 1 or 2 outer layers

(min. 3 working days)

 
micro vias

Type II  (1C1) (1C0)

 micro vias

Multilayer with micro vias
on 1 or 2 outer layers
as well as buried vias

(min. 7 working days)

 
micro vias

Type III  (2C0) (2C1) (2C2)

 micro vias

Multilayer with micro vias
on 1 or 2 outer layers
and on multiple planes
as well as buried vias

(min. 10 working days)

Materials
Dielectric: glass fabric and flexible polyimide foils.
For better reliability we prefer glass fabric reinforced laminates for micro via applications.