Design overview for high density interconnects (HDI) and laser drilled micro vias according to IPC / JPCA-2315
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Type I (1C1) (1C0) |
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Multilayer with micro vias |
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(min. 3 working days) |
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Type II (1C1) (1C0) |
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Multilayer with micro vias |
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(min. 7 working days) |
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Type III (2C0) (2C1) (2C2) |
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Multilayer with micro vias |
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(min. 10 working days) |
Materials |
Dielectric: glass fabric and flexible polyimide foils. |
For better reliability we prefer glass fabric reinforced laminates for micro via applications. |