Layout

Design overview

The following table gives you an overview of the dependence of pad size, track and drill size to each other. Modifying width and diameter affects the pitch of tracks. Please increase the track width and pad size, whenever it is possible.

Layout	Design class ->		200 µm	100 µm	HDI
	A	Track-to-track gap	0.20	0.10	0.10
	B	Track width	0.20	0.10	0.10
	C	Pad diameter micro via	-	-	0.30
	D	Drill diameter micro via	-	-	0.10
	E	Track-to-pad gap	0.20	0.10	0.10
	F	Mechanical drill diameter	0.60	0.25	0.25
	G	Pad diameter	1.00	0.60	0.55
	H	Route clearance	0.40	0.30	0.30
	I	Copper clearance	0.40	0.30	0.30
	X	Pitch of tracks (G+B) / 2 + E	0.80	0.45	0.30

Minimal pad diameter for micro vias = 3 x drill Ø micro via

Soldermask
	A	Web width of solder mask	min. 100 µm
	B	Excess of solder mask	min. 75 µm
	C	Hole clearance	min. 50 µm
	D	Pad clearance	min. 50 µm
	F	Coating thickness	20 - 50 µm
	G	Coating thickness over tracks	> 8 µm
		Viamask optional

Panels and board sizes

Please notice our maximal board sizes when designing your PCB.