Advice for further processing prior to the soldering process
Due to the fact, that the materials used have different water absorption characteristics and the vapor pressure during soldering can lead to delaminations, it is strongly recommended to dry the circuits prior to the soldering, as described below:
|
Material |
°C |
Drying time |
Soldering process within |
|
Epoxy glass laminate |
110 |
2 h |
24 h |
|
HTG epoxy glass laminate |
110 |
2 h |
24 h |
|
Polyimide glass laminate |
120 |
2-4 h |
4-8 h |