The contacts of the pcb have to be protected with a finish. This finishing is used as support of
the different soldering and contact processes as well as for protection of bare copper
against oxidation. The choice of the right surface depends on the technical
requirements (eg. bonding), the design (eg. pitch), and the operating field (eg. thermal shock).
Finish
Typical thickness
Application
electroless nickel / gold
0.05 - 0.07 µm Au, 4 - 7 µm Ni
soldering, bonding, finepitch
electroless tin
0.8 - 1.0 µm Sn*
soldering, finepitch
HAL lead free
1 - 8 µm Sn
soldering, multiple soldering
HAL (Hot Air Levelling)
1 - 8 µm Pb/Sn
soldering, multiple soldering
tin lead reflow
8 µm Pb/Sn
soldering, multiple soldering
plated nickel / gold
1.5 µm Au, 3 - 6 µm Ni
gold connector
plated nickel
3 - 6 µm Ni
receptable connection
*) thickness of > 1.0 µm in tin finish is possible, please contact us
