The laminates used in the electronics industry belong to the fibre compost materials and
consist of reinforcement fabric (e-glass) and a plastic matrix (resin bed). For rigid base
materials nearly exclusively e-glass fabrics are used. By using different resin systems the
features of the base materials can be changed.
* Please contact us in advance to verify the availability of this material.
FR4 epoxy laminate TG 135
FR4 still is the standard base material for pcb production. The TG is between 110 and 140 °C.
HTG epoxy laminate TG 180
Laminates on epoxy resin basis are used with mixed resins like triazine resin in order to
increase the TG. HTG epoxy laminates are available with a TG between 145 and 180 °C.
Cyanate ester laminate TG 250
High performance laminates for requirements with high responsibility or high operation
temperatures. Cyanate ester laminates show a better expansion reaction in x and y and are a
very good alternative to polyimide laminates. A disadvantage is the higher moisture absorption.
Polyimide laminate TG 220
High performance laminates for requirements with high responsibility or high operation
temperatures. This laminate is preferably used in military aerospace. The disadvantages are
the slightly brittle resin, a higher moisture absorption and the slightly lower adhesion
strength of the copper foil.
Aramid laminate TG 180-220
The core material is an unwoven aramid fibre. Very little x-y expansion reaction, relative
easy and good laser drillability. Disadvantage is the high z-axis expansion.
Our rigid laminates are in accordance with the IPC-4101 class B/L.
Polyester films (low cost electronic) or polyimide films (trade name kapton) are used as flexible
cores. We use exclusively polyimide films, as these have a much higher solder bath resistance
and therefore can be used for nearly all electronic applications.
We use two different groups of flexible laminates:
Laminates with acrylic adhesive coating (LF)
To laminate (clad) copper onto the flexible core the manufacturer uses a 25 µm thick acrylic
adhesive. This material does not meet the reqirements of UL 94-V0. In addition acrylic adhesive
has a very high z-axis expansion which can cause barrel cracking in case of thermal stress.
Adhesiveless laminates (AP)
To laminate copper onto the flexible core the manufacturer uses anchor polyimides. These
laminates are free of disturbing adhesive coating. The advantage of adhesiveless laminates
can only be used if no cover foil is used within the through-hole platings (window technology).
Coverlays (LF, FR)
A coverlay is a composite material of a Kapton polyimide film covered on one side with acrylic
adhesive. The FR type coverlay has a flame retardant acrylic adhesive, making it UL 94-V0
compliant. In this case FR coverlays should be used with adhesiveless laminates (AP).
Flexible materials
Acrylic adhesive
Polyimide film
Polyimide prepreg
Moisture absorption in %
4
1.33
0.7
CTE "Z" [ppm / °C]
425
48
55
TG glas transition temperature [°C]
40
390
210
Further information and data sheets are available at the manufacturers
DuPont and
Arlon.
HF laminates (Teflon)
Among the high frequency laminates you find pure PTFE (teflon) glass laminates and compositions
of teflon, ceramics, and modified resin systems. HF laminates are very different in processing,
electrical features, and price (factor 1 to 20). Typical applications are eg. radar systems,
cellular phone network, or microwave transmission systems.
PTFE substrates (thermoplastics like eg. teflon) are the most used materials in microwave
technology. The classical RT/duroid qualities by Rogers belong to this group. The range is
comleted by the thermosetting TMM® substrates which combine the mechanical strength of
ceramics (low coefficeint of expansion) and good dielectric results. For mass applications
in the low cost area (cellular phone network, communication and sensor technology) the obvious
materials are the new RO3000 substrates on PTFE basis as well as the more rigid RO4000
qualities on polymer basis. The RO4000 substrates (thermosetting plastic) can be processed
as cost effective as FR4, even as multilayers.
Depending on frequency area (500 MHz - 100 GHz) and application the user chooses a base material
with an exactly defined relative dielectric constant keeping the loss factor as low as possible.
HF laminates (1/2) (Teflon)
Dielectric constant @ 10 GHz
2.33 ±0.020
2.20 ±0.020
2.4-2.6 ±0.040
2.94 ±0.040
6.15 ±0.150
10.2 ±0.250
3.27 ±0.032
4.50 ±0.045
Thermal coefficient of εr -50 - 150 °C ppm/°C
-115
-125
-100
+12
-410
-425
+39
+15.3
Dissipation factor @ 10 GHz
0.0012
0.0009
0.0019
0.0012
0.0019
0.0023
0.0020
0.0020
Volume resistivity MΩ cm
2x107
2x107
2x107
106
2x107
5x106
3x109
6x108
Surface resistivity MΩ
2x108
3x107
4x107
107
7x107
5x106
9x109
1x109
Moisture absorption in %
0.015
0.015
0.03
0.1
0.05
0.05
0.04
0.01
Thermal conductivity W/m/°K
0.22
0.20
0.24
0.60
0.49
0.78
0.70
0.70
CTE "X&Y" [ppm / °C]
22-28
31-48
15-15
16-16
47-34
24-24
16-16
14-14
CTE "Z" [ppm / °C]
173
237
200
24
117
24
20
20
Density g/cm³
2.2
2.2
2.2
2.1
2.7
3.1
1.78
2.07
HF laminates (2/2) (Teflon)
Dielectric constant @ 10 GHz
6.00 ±0.080
9.20 ±0.230
9.80 ±0.245
3.00 ±0.040
6.15 ±0.150
10.2 ±0.300
3.38 ±0.050
3.48 ±0.050
Thermal coefficient of εr -50 - 150 °C ppm/°C
-10
-38
-43
+13
-160
-280
+40
+50
Dissipation factor @ 10 GHz
0.0023
0.0023
0.0020
0.0013
0.0020
0.0023
0.0027
0.0037
Volume resistivity MΩ cm
1x108
2x108
2x108
107
103
103
1.7x1010
1.2x1010
Surface resistivity MΩ
1x109
4x107
4x107
107
103
103
4.2x109
5.7x109
Moisture absorption in %
0.06
0.09
0.16
< 0.1
< 0.1
< 0.1
0.06
0.06
Thermal conductivity W/m/°K
0.72
0.76
0.76
0.50
0.61
0.66
0.64
0.62
CTE "X&Y" [ppm / °C]
16-16
16-16
16-16
17-17
17-17
17-17
11-14
14-16
CTE "Z" [ppm / °C]
20
20
20
24
24
24
46
50
Density g/cm³
2.37
2.77
2.77
2.1
2.6
3.0
1.8
1.9
RT/Duroid 5870, RT/Duroid 5880
Very low dimensional stability in x-y and z. This material is very sensitive to pressure and
tensile stress. The production of multilayers is difficult.
Ultralam 2000
High dimensional stability in x-y but very high z-axis expansion. Mechanical solid material.
Suitable for multilayer production.
RT/Duroid 6002
Very high dimensional stability in x-y and z. Due to the low z-axis expansion suitable
for multilayer production.
RT/Duroid 6006
High dimensional stability in x-y but relatively high z-axis expansion. Suitable for
mulltilayer production. This material is very sensitive.
RT/Duroid 6010 LM
High dimensional stability in x-y and z. Therfore suitable for multilayer production.
This material is very sensitive.
TMM 3, TMM 4, TMM 6, TMM 10, TMM 10i
Very high dimensional stabiliy in x-y and relatively high z-axis expansion. Suitable for
multilayer production. Solder resist can be applied. Suitable for hybrid circuits (material
mix with FR4). Processing like FR4. This material is very brittle. TMM 10i can be used as a
substitute for AL²O³ ceramics.
RO 3003, RO 3006, RO 3010
Very high dimensional stability in x-y and z. This material has good mechanical features and is
suitable for multilayer production as well as for hybrid ciruits (material mix with FR4).
RO 4003 C, RO 4350 B
Very high dimensional stability in x-y and relatively high z-axis expansion. This material
is suitable for multilayer production as well as for hybrid circuits (material mix with FR4).
Solder resist can be applied.
Further information and data sheets are available at the manufacturer
Rogers Corporation or at the supplier
Mauritz.
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