Soldering

The materials of the printed circuit board have different water absorption values. During soldering, heat can cause the water to evaporate, thus building up pressure, which leads to delamination. Therefore each board should be baked before soldering.

 

Water
absorption

Baking

Soldering
within

Epoxy glas laminate

0.15 %

110°C / 2h

24 h

HTG epoxy glas laminate

0.15 %

110°C / 2h

24 h

Polyimide glas laminate

0.35 %

120°C / 2-4h

4 - 8 h

Cyanat ester glas laminate

0.50 %

120°C / 2-4h

4 - 8 h

Thermount HTG epoxy

0.44 %

120°C / 2-4h

4 - 8 h

Thermount polyimide

0.81 %

120°C / 6h

4 h

Flexible polyimide

0.85 %

120°C / 6h

4 h