This page offers an overview of the IPC standards for the printed circuit board industry.
As default the IPC standards 6011, 6012, 6013 und 6016, class II are used.
The conformity of the pcb's is inspected according to IPC-600F.
General
name
issue
supercedes
Terms and definitions for interconnecting and packaging electronic circuits
IPC-T-50-F
06/1996
IPC-T-50-E
Dimensions and tolerances
IPC-D-300-G
06/1996
-
Design
name
issue
supercedes
Surface mount design and lands pattern standard
IPC-SM-782-A
10/1996
-
Design guidelines
for reliable SMT printed board assemblies
IPC-D-279
07/1996
-
Generic
standard for printed board design
IPC-2221A
05/2003
IPC-2221
Sectional design
standard for rigid organic boards
IPC-2222
02/1998
IPC-D-275
Sectional design
standard for flexible printed boards
IPC-2223
11/1998
IPC-D-275
Material
name
issue
supercedes
Specification
for base materials for rigid and multilayer printed boards
IPC-4101
12/1997
MIL-S-13949-H
Specification
for base materials for HF applications
IPC-4103
01/2002
IPC-L-125-A
Flexible base
dielectrics for use in flexible printed circuitry
IPC-4202
05/2002
MIL-S-13949-H
Adhesive coated
dielectric films for use as cover sheets for flexible printed circuitry
and flexible adhesive bonding films
IPC-4203
05/2002
IPC-FC-232-C IPC-FC-233
Flexible metal-clad
dielectrics for use in fabrication of flexible printed circuitry
IPC-4204
05/2002
IPC-FC-241-C
Metal foil
for printed wiring applications (i.e. Cu, Ni)
IPC-4562
05/2000
IPC-MF-150-F
Composite
metallic material specification for printed boards (CIC, CMC)
IPC-CF-152-B
03/1998
IPC-CF-152-A
Qualification
and performance of permanent solder mask
IPC-SM-840-C
01/1996
IPC-SM-840-B
Production
name
issue
supercedes
Generic
performance specification for printed boards
IPC-6011
07/1996
IPC-RB-276 IPC-ML-950
Qualification and
performance specification for rigid printed boards
IPC-6012
07/1996
IPC-RB-276 IPC-ML-950
Qualification and
performance specification for flexible printed boards
IPC-6013
-
IPC-RB-276 IPC-ML-950
Qualification and
performance specification for high density interconnect layers or boards. (HDI)
