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	Menu Welcome Products Profile References Certification Impressum Your order Contact Pricing Services Design Material Production   Intro   Quality   Ecology   Standards   Soldering Data transfer		Soldering The materials of the printed circuit board have different water absorption values. During soldering, heat can cause the water to evaporate, thus building up pressure, which leads to delamination. Therefore each board should be baked before soldering. Water absorption Baking Soldering within Epoxy glas laminate 0.15 % 110°C / 2h 24 h HTG epoxy glas laminate 0.15 % 110°C / 2h 24 h Polyimide glas laminate 0.35 % 120°C / 2-4h 4 - 8 h Cyanat ester glas laminate 0.50 % 120°C / 2-4h 4 - 8 h Thermount HTG epoxy 0.44 % 120°C / 2-4h 4 - 8 h Thermount polyimide 0.81 % 120°C / 6h 4 h Flexible polyimide 0.85 % 120°C / 6h 4 h