Logo Hans Brockstedt GmbH
PCB express service
Menu
Welcome
Products
Profile
References
Certification
Impressum
Your order
Contact
Pricing
Services
Design
Material
  Intro
  Ecology
  Standards
  Soldering
Data transfer
Quality
AOI Quality assurance and training
Quality and production assurance are significant issues. Our production systems and processes are constantly being monitored. Each board has its own traveller, processed with a powerful rule based software.
Barcoding is used to document each step in the production process. Our production-tracking system allows us to access all different kinds of data: production systems, processes, operators, duration, top- and sublevels as well as raw materials and batch numbers.
Each employee is permanently trained in processes and technologies. The training level is recorded in a personal training document.
Testing
During the production process, multiple optical and electrical tests are carried out. For optical testing we use Orbotech and Mania-Barco AOI systems. Electrical testing is performed by Probot flying probe testers and Mania bed-of-nail testers.
Electrical testers:
Bare Board Tester Mania BSL Probot
Test method bed-of-nails finger tester finger tester
Test voltage 40 V DC
(> 2 MΩ)
250 V DC
(> 4 MΩ)
250 V DC
(> 4 MΩ)

Laboratory
Lot conformance inspection report:
Qualification and conformance inspection according to MIL-PRF-55110 F
Qualification and conformance inspection according to MIL-P-50884 C
Qualification and conformance inspection according to MIL-PRF-31032/1A, 31032/2, 31032/3, 31032/4
IPC-6011, 6012, 6013, 6016 class I, II or III
According to your requirements
Acceptability of printed boards according to IPC-600F class I, II oder III

Product inspections Inspection requirements
Microsections Layer and plating thicknesses, etchback, hole plating, misregistration, annular ring, dielectric thickness
Thermal stress Lifted lands, delamination, hole wall cracks
Thermal cycling Electrical functionality
Insultating test Dielectrical withstanding
Rework Rework simulation
Environmental test Isolation and moisture resistance
Peel strength Copper adhesion
Impedance High frequency resistance measurements (microstrip only)
Bending endurance Flexibility test of flexible pcb's
UL Flame ability test Flame ability test according to UL
Electro corrosion Siemens standard

Process inspection Inspection requirements
Chemical process inspection Bath analyses
Back light test Electroless plating qualtity
Ductility Ductility of plating copper
Contamination Degree of surface contamination
Crosshatch test Solder mask adhesion after soldering
Solderability Hole and surface solderability
PerfecTest Layer misregistration