Layout

Design overview

The following table gives you an overview of the dependence of pad size, track and drill size to each other. Modifying width and diameter affects the pitch of tracks. Please increase the track width and pad size, whenever it is possible.

Layout

Design class ->

200 µm

100 µm

HDI

Layout

A

Track-to-track gap

0.20

0.10

0.10

B

Track width

0.20

0.10

0.10

C

Pad diameter micro via

-

-

0.30

D

Drill diameter micro via

-

-

0.10

E

Track-to-pad gap

0.20

0.10

0.10

F

Mechanical drill diameter

0.60

0.25

0.25

G

Pad diameter

1.00

0.60

0.55

H

Route clearance

0.40

0.30

0.30

I

Copper clearance

0.40

0.30

0.30

X

Pitch of tracks (G+B) / 2 + E

0.80

0.45

0.30

Minimal pad diameter for micro vias = 3 x drill Ø micro via

Soldermask

Soldermask

A

Web width of solder mask

min. 100 µm

B

Excess of solder mask

min. 75 µm

C

Hole clearance

min. 50 µm

D

Pad clearance

min. 50 µm

F

Coating thickness

20 - 50 µm

G

Coating thickness over tracks

> 8 µm

 

Viamask optional

 


Panels and board sizes

Please notice our maximal board sizes when designing your PCB.

Rigid PCB's

Rigid-flexible PCB's

Panel

Board

Panel

Board

380 x 288 mm

334 x 234 mm

380 x 288 mm

334 x 234 mm

575 x 380 mm

525 x 334 mm

575 x 380 mm

525 x 334 mm

600 x 440 mm

550 x 390 mm

600 x 440 mm

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710 x 550 mm

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