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Order
PCB Name Quantity
Delivery time [work. days] Repeat order
Electrical testing Acc. to
 MIL  IPC cl. 3

Technical data (general)
Laminate
 FR 4  HTG  Polyimide glass
 Polyimide foil  Cyanat-Ester  other
Teflon type
Board thickness [mm]
Multiple image panel Boards per panel
Board size [mm]
x
Panel size [mm]
x
Track width [µm] Track spacing [µm]
Layer count
 total  rigid  flex  CIC

Technical data (mechanics and specials)
Milling programs  [qty.] Outer contour  [corners]
Smallest cutter Ø  [mm] Additional slots  [qty.]
Min. drill Ø  [mm] Mech. drilled holes  [qty.]
Laser drilled holes  [qty.] Planes  [qty.]
Blind or buried vias  [qty.] Planes  [qty.]
Sequ. buildup (SBU)  [qty.] Heatsink  [qty.]
Edge plating Gold connector (length)  [cm]

Technical data (photo imaging and surfaces)
Probimer
 0  1  2
(standard solder mask)
Legend print
 0  1  2
 
Tenting mask
 0  1  2
Peel off
 0  1  2
Surfaces
(* = standard)
 HAL leaded  Electrol. Ni/Au (*)  Electroless Sn (*)
 HAL lead free  Plated Ni/Au  PbSn
Cu plating > 70 µm

Remarks

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