Further processing

Advice for further processing prior to the soldering process



Due to the fact, that the materials used have different water absorption characteristics and the vapor pressure during soldering can lead to delaminations, it is strongly recommended to dry the circuits prior to the soldering, as described below:

Material

°C

Drying time

Soldering process within

Epoxy glass laminate

110

2 h

24 h

HTG epoxy glass laminate

110

2 h

24 h

Polyimide glass laminate

120

2-4 h

4-8 h