Design overview for high density interconnects (HDI) and laser drilled micro vias according to IPC / JPCA-2315

	Type I  (1C1) (1C0)
	Multilayer with micro vias on 1 or 2 outer layers
	(min. 3 working days)
	Type II  (1C1) (1C0)
	Multilayer with micro vias on 1 or 2 outer layers as well as buried vias
	(min. 7 working days)
	Type III  (2C0) (2C1) (2C2)
	Multilayer with micro vias on 1 or 2 outer layers and on multiple planes as well as buried vias
	(min. 10 working days)