The following table gives you an overview of the dependence of pad size,
track and drill size to each other.
Modifying width and diameter affects the pitch of tracks.
Please increase the track width and pad size, when ever it is possible.
Layout
Design class ->
200 µm
100 µm
HDI
A
Track-to-track gap
0.20
0.10
0.10
B
Track width
0.20
0.10
0.10
C
Pad diameter micro via
-
-
0.30
D
Drill diameter micro via
-
-
0.10
E
Track-to-pad gap
0.20
0.10
0.10
F
Mechanical drill diameter
0.60
0.25
0.25
G
Pad diameter
1.00
0.60
0.55
H
Route clearance
0.40
0.30
0.30
I
Copper clearance
0.40
0.30
0.30
X
Pitch of tracks (G+B) / 2 + E
0.80
0.45
0.30
Minimal pad diameter for micro vias = 3 x drill Ø micro via
Minimal pad diameter for mech. drills see pad size calculation
Solder mask
A
Web width of solder mask
min. 100 µm
B
Excess of solder mask
min. 75 µm
C
Hole clearance
min. 50 µm
D
Pad clearance
min. 50 µm
F
Coating thickness
20 - 50 µm
G
Coating thickness over tracks
> 8 µm
Viamask optional
Panels and board sizes
Please notice our maximal board sizes when designing your PCB.
