The
demands, opportunities and technologies in the PCB production are changing
as fast as the electronic components.
Comprehensive and detailed knowledge is needed for designing and manufacturing of boards.
Often you will reach technical limits. You can get help from
several design standards:
IPC-2221 Generic, IPC-SM-782 SMD, IPC-2222 Rigid, IPC-2223 Flex,
IPC-2252 RF, IPC-2315 HDI.
Concerning any question of design, material selection, layer buildup,
reliability or technology feel free to contact us, we would like to
help you with all our know-how.
Picture: Here is a typical layout as a screenshot from the CAT/CAM-system shown.
You can see a plane on an inner layer (orange) with clearance areas (white)
and an outer layer (red) with tracks, round pads, rectangular SMD-pads
and a ball grid array (BGA).
In this case the holes (yellow) are split into three different drilling programs
to connect several layer stacks.
The
demands, opportunities and technologies in the PCB production are changing
as fast as the electronic components.
Comprehensive and detailed knowledge is needed for designing and manufacturing of boards.
Often you will reach technical limits. You can get help from
several design standards:
IPC-2221 Generic, IPC-SM-782 SMD, IPC-2222 Rigid, IPC-2223 Flex,
IPC-2252 RF, IPC-2315 HDI.