Connection types
	A	Blind via (depth controlled)	Ø ≥ 0.20 mm, AR 1:1
	C	Buried via (resin filled)	Ø ≥ 0.20 mm, AR 1:9
	E	Micro via (laser drilled)	Ø ≥ 0.10 mm, AR 1:1
	F	Blind via (resin filled)	Ø ≥ 0.20 mm, AR 1:9
	G	Through via (mechanical drilled)	Ø ≥ 0.25 mm, AR 1:9
			AR = aspect ratio

"Aspect ratio" is the relation between drill depth and drill diameter.

Blind vias (depth controlled)
	K	calculate 50 µm for drill point
	L	actual drill depth (aspect ratio max. 1:1)
	M	min. 150 µm dielectric spacing